Role & Opportunity:
The responsibilities of this position are focused on specifying, designing (schematic capture, PCB layout, implementing and verifying the motherboard and other various sub-system boards that make up the Surface product. This work includes development of requirements and evaluating different solution for functionality, cost, and risk. The subsystems on the motherboard include (but are not limited to): High speed buses (front side bus, memory bus, PCIe bus, SATA bus, USB bus, I2S, I2C,UART,etc.), memory, Ethernet, Wi-Fi, processors, audio/video, system clocking, power and thermal management, and misc. analog/digital circuitry. The position involves working closely with industrial designers, electrical engineers, BIOS engineer, mechanical engineers, software engineers, test engineers, component engineers, and program managers.
Candidates should be able to apply core electrical engineering hardware and firmware skills to drive detailed problem solving on products within a technical team as well as manage broader industry standards, interoperability and compatibility testing with external development and test partners.
Qualifications:
? Minimum BS in Electrical Engineering or Computer Engineering or related field.
? Minimum of 5+ years’ experience contributing to the design and production of complex products in the electronics industry.
? A solid understanding of core engineering principles, fundamental circuit design, and analytical techniques is required. Familiar with high speed design signal integrity issues, power distribution techniques, system clock & modern processors
? Familiarity with embedded system architectures hardware and software, experience with implementation of high speed serial buses (SATA, PCIe, USB) and/or high speed parallel buses such as: memory bus (DDR2, GDDR3, etc.), CPU front side bus, Hyper transport, and/or voltage regulator/ power delivery design a plus.
? Strong bench evaluation and in-lab debugging skills are required.
? Hands-on board design experience, familiar with design tools including Cadence and Allegro.
? Good understanding of electronic assembly processes
? Conducting detailed failure analysis on mother board and computer external interface; working with manufacturing and engineering teams to put in corrective actions
? Strong communication skills required, including the ability to clearly express technical concepts in verbal and written forms. Will need to communicate with team members is USA.
? Must be able to plan work, and work to a plan adapting as necessary in a rapidly evolving environment.
? Enthusiastic, motivated and self-driven.
? Experience with computer mother board, firmware/UEFI, BIOS or FPGAs desired
? Experience with Cadence desired
? Design for manufacturing and test experience is required. Experience with CDM partners is desirable.
? The ability to comprehend and assimilate technical concepts across multiple disciplines is a plus.
? Domestic and international travel may be required.

上海微創(chuàng)軟件，作為中國領(lǐng)先的ITO和BPO服務(wù)提供商，多年來持續(xù)為眾多行業(yè)領(lǐng)先公司提供專業(yè)的技術(shù)和服務(wù)解決方案，所涵蓋的領(lǐng)域包括高科技、通信、制造業(yè)和分銷與零售業(yè)。

2002年，微軟公司與上海市政府共同投資創(chuàng)立微創(chuàng)軟件，目前全球共有11處主要的運(yùn)營中心，其中在中國有7處，分別位于上海、北京、深圳、蘇州、北海、重慶與常州，另有4處國際分公司位于美國西雅圖、日本東京、大阪和歐洲瑞典。微創(chuàng)的客戶遍布全球，其中外國客戶包括美國的微軟、英特爾、惠普、DSM、Wal-Mart和Atheros公司等，中國的客戶有中國電信、中國移動(dòng)、華為、聯(lián)想、盛大網(wǎng)絡(luò)等。微創(chuàng)軟件同時(shí)也是微軟在中國的最佳VAR和LAR之一。

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